Backend Turnkey Service

Backend Turnkey Service

SMIC offers comprehensive services from wafer manufacturing to finish goods IC to customers.


SMIC cooperates with world-class OSAT (Outsourced Semiconductor Assembly and Test) to offer more comprehensive services for customer requirements, including Wafer Bumping, Wafer Level Package, Chip Scale Package, Conventional Package,  Testing and On-chip Color Filter services.

Backend Turnkey Service Partner

If you have backend requirement, please contact SMIC Sales Team.

SMIC Backend Service